Quid est causa pauperum adhaesionem inter TPE thermoplastic elastomer et PC?

In the diversified application scenarios of plastic products, the composite use of TPE thermoplastic elastomer and PC is becoming more and more common, such as electronic product shells with soft touch and high strength, automotive interior parts, etc. However, in actual production, TPE and PC often delaminate and debond, which not only affects the appearance of the product, but also affects its functionality and service life. Quid ergo scis quid sit? Sit scriptor explorarent eam cum Huizhou Zhongsuwang Editor.

I. Pelagus ratio pauperum adhaesionem inter TPE thermoplastic Elastomer et PC

I. Chemical compages difference: PC moleculae continent Suspendisse carbonate coetus et excelsum superficiem industria; Dum TPE thermoplastic elastomers ut Sebs sunt plerumque non-Suspendisse vel humilis-Suspendisse, et difficile ad duo ad formam chemical vincula.

II. Superficiem Energy mismatch, TPE Thermoplastic Elastomer est humilis superficiem industria, et non potest esse plene diffundere in PC superficiem post liquescens. Sunt hiatus in interface, unde humilis vinculum vires.

III. Processing technology exitibus: PC processus temperatus est princeps, TPE materia est pauper calor resistentia, et temperatus differentia durante co-iniectio est pronus ad scelerisque accentus; PC superficiem release agente reliqua et afficit compositum ex duobus.

IV. Alia Crystallization mores: Quidam TPE Thermoplastic elastomers habent microcrystalline structuris, dum PC est amorphous polymer. Duo habent pauperes thermodynamic compatibilitatem et sunt prone ad accentus concentration.

II. Modi ad amplio pauperes Adhaesionem inter TPE Thermoplastic Elastomer et PC Polycarbonate

I. superficiem curatio

Chemical Treatment: Usus Infirmum acidum solution seu organicum solvendo extergimus in PC superficiem ad removendum release agente et oleum maculis et auget superficiem industria.

Physical curatio: Usus Plasma aut corona curatio ad augendam in Suspendisse coetibus in PC superficiem et augendae chemical vinculum cum TPE Thermoplatoris Elastomer.

II. Selectio tenaces

Special Adhesive: Select Adhesives quibus Suspendisse coetibus, ut acrylates et polyurethanis, ad formare fortis vinculum per eget profectae.

Blending Compatibilizer: Add V% -10% Sebs-G-Mah maleic anhydride inserere Sebs ad TPE Thermoplastic Elastomer ad amplio compatibility cum PC.

III. Processus Optimization

In-fingunt iniectio CUMATIUM: injects TPE material statim post PC iniectio CUMATIUM, et uti RELICTUM calor in PC superficiem ad promovere intermolecular.

Calidum Meltant WELDING: Usus calidum laminam WELDING aut Ultrasonic WELDING ad conflandum et iungere duo materiae ad interface.

IV. Material immutatio

PC Modification: Add I% -3% of Compatibilizer, ethylene-Acidum Copolymer potest amplio superficies operatio PC.

TPE Formula temperatio: Auget styrene contentus ad XXX% -40% ad augendae interface vinculum vires inter TPE Thermoplastic Elastomer et PC.

Ad solvere hoc problema, necesse est ut satus cum eget modificatio, superficiem curatio et processus optimization et replete gap in materia proprietatibus per augendae interface polarity matching vel physica anchoring. Tantum per specie solveret per compatibility bottleneck can consequi stabilis stabulale, ita expanding in spatio compositus, ita expanding ad compositum materia applications.